| 摘要 |
PROBLEM TO BE SOLVED: To provide an aligner device in which a chipped portion in a wafer can be detected with high accuracy in a wafer edge grip method. SOLUTION: The aligner device for detecting the chipped portion formed in a peripheral edge of the wafer is provided with a first holding mechanism for holding a portion of the peripheral edge of the wafer, a second holding mechanism for holding a portion of the peripheral edge of the wafer that is different from the portion held by the first holding mechanism, a photographing means for projecting light rays on the peripheral edges of the wafer held by the first and second holding mechanisms, respectively to photograph the peripheral edges of the wafer, and an image processing means for processing at least one of the images photographed by the photographing means to detect the chipped portion. COPYRIGHT: (C)2004,JPO |
