| 摘要 |
PROBLEM TO BE SOLVED: To provide a working method of a semiconductor wafer for reducing damage of the wafer in working and transfer of the thin film wafer and the wafer of a large diameter. SOLUTION: In a series of processes for bonding a protection adhesive tape 1 to a circuit surface of the semiconductor wafer 2, grinding a rear face of the wafer, thinning the wafer, bonding a reinforcing sheet 3 to the ground wafer rear face, bonding an adhesive sheet for dicing 4 to a reinforcing sheet side of the wafer, fixing the wafer to a ring frame 5 through the adhesive sheet for dicing and peeling the protection adhesive tape bonded to a surface of the wafer, a state where the wafer is reinforced by the protection adhesive tape, the reinforcing sheet or at least a part of a constitution layer of them is maintained. The wafer is diced and is made into chips. Then, the chips are picked up. COPYRIGHT: (C)2004,JPO |
