ENCAPSULATING METHOD OF DEVICE HAVING ORGANIC SEMICONDUCTOR AS BASE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To encapsulate a device having organic semiconductor and to provide the encapsulated device with high sealing performance. SOLUTION: (1) A substrate as a vessel part having an electrically connecting terminal, the other vessel part including at least one lid, and glass wax are prepared, and coefficients of thermal expansion of the substrate, the other vessel part, and the glass wax are alternately matched by setting difference between the coefficients at 1.0×10-6K-1or lower. Then, (2) the glass wax is mixed with a binder or a solvent if necessary, (3) the glass wax is placed in a shape of a wall (seam or bead) going around on at least the lid, (4) the binder or solvent is removed if necessary, (5) the glass wax is sintered, (6) a layer representing the semiconductor device including an electrode is disposed on the substrate, (7) the lid is placed on the substrate, and (8) the glass wax is locally heated by a light source having previously provided peak wavelength. COPYRIGHT: (C)2004,JPO