| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame which can connect stably a semiconductor element with a lead in a plastic molded semiconductor device in which a die pad is not exposed, and to provide a plastic molded semiconductor device using the lead frame and a manufacturing method of the semiconductor device. SOLUTION: An insulator layer 8 is disposed on the bottom surface 2a of the die pad 2. The thickness of the layer 8 is equal to a step between the bottom surface 3b of a lead 3 and the bottom surface 2a of the die pad 2 which exists as a result that the die pad 2 is set up. Thus the bottom surface 3b of the lead 3 and the bottom surface 8a of the insulator layer 8 are arranged on almost the same plane. COPYRIGHT: (C)2004,JPO |
