| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board which enables the easy formation of a plurality of external connection terminals integrally formed with a substrate, into a desired shape, for example, of the same height, and also to provide the wiring board manufactured by the same. SOLUTION: A film-like molding 17 formed of insulating resin is held between a pattern formation face of the substrate 10 and a metal plate 30 formed with through holes 30a. The insulating resin is allowed to project from the through holes 30a, and then projecting part of the insulating resin is removed to form insulating projections 19, followed by removal of the meta plate 30. A conductor layer 16a is so formed as to cover the surface of the insulating projections 19 to form the external connection terminals 20. COPYRIGHT: (C)2004,JPO |
