| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive film capable of sufficiently responding to a demand of high density mounting especially for semiconductor package because of its property of not generating short circuit between adjacent electrodes aligned with small pitch, capable of surely and conductively connecting under low pressure, not fusing even when large current flows, handling high frequency signal, especially suitable for contact probe mounting, and to provide a manufacturing method of the same. SOLUTION: As a conductive component, the anisotropic conductive film contains numerous fine metal particles connected in a chain shape. Especially in a case of mounting semiconductor package, the length of the chain is made not longer than the distance between conductively joined adjacent electrodes. In the case of mounting the contact probes, the length of the chain is made to range between 1 to 20μm. For the manufacturing method, the film is formed by orientating the chain made of paramagnetic metal by magnetic field. COPYRIGHT: (C)2004,JPO |
