| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device wherein external terminal sections are arranged like a lattice on a plane, which can reduce a cost and improve a reliability and electrical characteristics of the semiconductor device. SOLUTION: The method of manufacturing the semiconductor device comprises processes of forming lead sections 66 on parts of a top face of a substrate 71 which will become columnar terminal sections 68, and forming terminal end 69 on corresponding parts of a bottom face of the substrate 71 to form a lead frame 72; mounting a semiconductor chip 61 on a prescribed position on the top face of the substrate of the lead frame 72 using a soluble insulation material 78, and electrically connecting the semiconductor chip 61 and the lead sections 66, sealing the semiconductor chip 61 and the lead sections 66 by sealing resin 63, removing the substrate 71 and the soluble insulation material, except for the parts where the terminal end 69 are positioned; coating an exposed bottom face of the semiconductor chip 61 and bottom faces of the lead sections 66, except for the external connection terminal sections 67, by an insulation member 81; and an outer-packaging process of forming an outer- packaging film 70 on the surfaces of the external connection terminal sections 67, each comprising the columnar terminal section 68 and the terminal end 69 projecting from the insulation member 81. COPYRIGHT: (C)2004,JPO
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