| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer circuit board and a board for multilayer circuit board which have high insulation reliability even if an insulation layer is thinned, enable high density of a wiring, and suppress an internal strain of the circuit board and the generation of a migration. <P>SOLUTION: A board for multilayer circuit board is composed of at least two layers of conductor metal layers 3, an insulating layer 1 laminated between the conductor metal layers 3, and a metal thin film layer 2 laminated on the surface of the insulating layer 1 side of the conductor metal layers 3. A multilayer circuit board 10 is formed by forming a lamination part S of the conductor metal layers 3 and the metal thin film layers 2, and a single layer T eliminating the conductor metal layers 3 on the metal thin film layers 2. <P>COPYRIGHT: (C)2004,JPO</p> |
