INTEGRATED CIRCUIT CHIP INCLUDING TEST ELEMENT GROUP CIRCUIT AND FABRICATION METHOD THEREOF

摘要

PURPOSE: An integrated circuit chip including a test element group circuit and a fabrication method thereof are provided, which performs an EDS(Electric Die Sorting) test and a TEG(Test Element Group) test at the same time in each integrated circuit chip formed on a wafer without increasing test time. CONSTITUTION: The semiconductor integrated circuit device formed on a semiconductor wafer(1) includes at least one first pad(22), and a plurality of second pads connected to corresponding internal circuits respectively, and the first test element group circuit(23) connected to the first pad. The above internal circuits and the first test element group circuit are tested at the same time. The first pad is a non-bonding pad, and the second pads are bonding pads.