| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multi-layered wiring substrate, as well as the multi-layered wiring substrate, that can be used for mounting an IC chip excellent in heat-resistance and adhesive reliability after moisture absorption, or as an interposer of an IC package. SOLUTION: The method at least comprises the steps of (a) joining a second wiring film with an adhesive onto a first wiring film that has a wiring pattern at least on one surface of it to build a lamination, the second wiring film that has at least one surface of it physically so roughened by a wet-blast treatment or the like that its surface roughness has an average roughness Rz at arbitrary 10 points being 0.1-5.0μm, (b) forming a blind via on the laminated second wiring film obtained in step (a) and embedding an electrically conductive substance into the blind via to make the interlaminar space electrically conductive, and (c) processing the electrically conductible layers into specific wiring patterns. Further, this method is inclusive of each step being continuously manufactured by the reel-to-reel technique. COPYRIGHT: (C)2004,JPO
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