发明名称 ETCHANT AND ETCHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an etchant that selectively etches a hafnium based oxide film and a zirconium based oxide film with respect to a silicon oxide film such as THOX or TEOS. SOLUTION: An etchant that selectively etches an oxide film containing hafnium and silicon, an oxide film containing hafnium and aluminium, an oxide film containing zirconium and silicon, or an oxide film containing zirconium and aluminium with respect to a thermally oxidized film; a method for producing an etching material that etches materials to be etched on which the above oxide films and a silicon oxide film are formed; and the etching material obtained from the method are provided. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003332297(A) 申请公布日期 2003.11.21
申请号 JP20020135864 申请日期 2002.05.10
申请人 DAIKIN IND LTD 发明人 ITANO MITSUSHI;MOMOTA HIROSHI
分类号 H01L21/308;H01L21/306;(IPC1-7):H01L21/306 主分类号 H01L21/308
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