发明名称 SUBSTRATE TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treating device which is capable of improving a heater in temperature uniformity through its surface, reducing a load imposed on a heater main body, and preventing cracks from occurring in the heater main body. SOLUTION: The substrate treating device is equipped with a plurality of the heaters which heat a plurality of regions to be heated, the heating temperature bands of the heaters are divided into a plurality of temperature bands (T1 and below, T1 to T2, T3 and above), and the heaters are set at output values (Z1 to Z4) in each temperature band and controlled to heat at the set output values (Z1 to Z4). When a temperature difference between the heaters exceeds an allowable value, the heating capabilities of the heaters are controlled by changing their output values. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003332208(A) 申请公布日期 2003.11.21
申请号 JP20020136973 申请日期 2002.05.13
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 YOSHIDA YASUSHI;SUZUKI KAZUNORI
分类号 H05B3/00;H01L21/027;(IPC1-7):H01L21/027 主分类号 H05B3/00
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