发明名称 SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment device which is equipped with a lift pin 40 that has improved in following properties when a temperature changes. SOLUTION: The substrate treatment device is equipped with a plate 33 for heating or cooling a substrate, the lift pin 40 which penetrates through the plate 33, is freely movable in a vertical direction, and supports the substrate, a slide member 51 provided to the lower end of the lift pin 40, a support member 42 which supports the lift pin 40 through the intermediary of the slide member 51 and moves up or down together with the lift pin 40, a wrapping member 52 which wraps the side and top of the slide member 51 so as to enable the slide member 51 to move sideways and fixed to the support member 42, a first linear bearing 53a interposed between the top surface of the slide member 51 and the undersurface of the wrapping member 52, and a second linear bearing 53b interposed between the undersurface of the slide member 51 and the top surface of the support member 42. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003332193(A) 申请公布日期 2003.11.21
申请号 JP20030077504 申请日期 2003.03.20
申请人 TOKYO ELECTRON LTD 发明人 MIZOSAKI KENGO;HIROSE OSAMU
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
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