BONDING DEVICE AND BONDING TOOL OF ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a bonding device and a bonding tool of an electronic component in which a stabilized vibration can be transmitted to a bonding action part. SOLUTION: In the US bonding tool 74 for compressing the electronic component 6 against a bonding face while applying a load and a vibration to the electronic component, a US vibrator 77 is fixed to the end face of a horn 75 on one side in the longitudinal direction, a vacuum suction hole 76c is made in the end face of the horn 75 on the other side to communicate with an electronic component suction hole 76a made at the bonding action part 75e provided on the lower surface side at a position corresponding to the antinode of standing wave vibration, and the vacuum suction hole 76c is connected with a vacuum suction source through a suction pad 79. A stabilized vibration can be transmitted to the bonding action part 75e while ensuring good mass balance of the horn 75. COPYRIGHT: (C)2004,JPO