| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board with a heat sink wherein heat generated from a semiconductor chip 2 can be effectively conducted to the heat sink 3, and it is prevented that electric connection between the semiconductor chip 2 and copper wiring 6 is separated by thermal stress. SOLUTION: In the printed board with a heat sink wherein the semiconductor chip is mounted in a resin part of the printed board, and wiring is connected with an electrode bump of the semiconductor chip, the wiring of the semiconductor chip is arranged on the side opposite to the heat sink. COPYRIGHT: (C)2004,JPO |
