发明名称 LEAD FRAME ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a lead frame structure that secures components on a lead frame (10), to maintain the positions of the components on the lead frame (10) during a premolding and/or overmolding process, with the structure allowing pre-assembly of the lead frame with the components, thereby facilitating subsequent premolding and/or overmolding processes. SOLUTION: The lead frame (10) has component receiving projections such as electrical connectors, adapted to receive components thereon such as ferrite filters, and also has a means for securing the positions of the components on the lead frame (10) during the premolding or overmolding process. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003332498(A) 申请公布日期 2003.11.21
申请号 JP20030127020 申请日期 2003.05.02
申请人 ILLINOIS TOOL WORKS INC 发明人 COOK ROBERT J;SMITH RONALD M;BENSON STEVEN R
分类号 H01L23/28;H01R13/719;H01R43/16;H01R43/24;(IPC1-7):H01L23/28 主分类号 H01L23/28
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