发明名称 CURING TYPE DIELECTRIC FORMING AGENT
摘要 PROBLEM TO BE SOLVED: To provide a dielectric forming agent, which cures rapidly in solventless compositions and is capable of producing an dielectric which provides a cured object superior in adhesive properties and electrical characteristics, even under high temperature. SOLUTION: The curing type dielectric forming agent comprises di(meth) acrylate which is represented by formula (1) (where, R<SB>1</SB>is a hydrogen atom or a methyl group; while n is an integer of 0 or larger). COPYRIGHT: (C)2004,JPO
申请公布号 JP2003331651(A) 申请公布日期 2003.11.21
申请号 JP20020136165 申请日期 2002.05.10
申请人 TOAGOSEI CO LTD 发明人 OKAZAKI EIICHI;SANAI YASUYUKI
分类号 C08F20/20;H01B3/44;(IPC1-7):H01B3/44 主分类号 C08F20/20
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