| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost substrate processor that effectively solves the unevenness on the back using a comparatively small number of back spray nozzles even for a thin, large, and flexible substrate that requires a high-density roller support. SOLUTION: A substrate 60 is conveyed with being supported by a large number of substrate-supporting rollers 13. A surface of the substrate 60 being conveyed is supplied with a chemical, and plural back spray nozzles 52 are arranged separately below the substrate conveyance line such that the chemical strikes on the rollers 13. Each of the nozzles 52 is oscillated such that the chemical is supplied to an entire surface of the substrate 60. The oscillation angle is determined such that the rollers 13 are not out of the spray area by the oscillation. The chemical is always supplied to the rollers 13, which is transferred to the back of the substrate 60, thereby the chemical is supplied even to the dead angle area for the spray. COPYRIGHT: (C)2004,JPO |
