发明名称 DEVICE AND METHOD FOR INSPECTING SOLDER FOR APPEARANCE
摘要 PROBLEM TO BE SOLVED: To provide a device for inspecting solder for appearance that can improve a function of identifying the applied state of solder applied to an electrode further enhancing the contrast between the electrode and solder. SOLUTION: This device for inspecting solder for appearance is provided with a light source 3 which projects light containing ultraviolet rays upon an object to be inspected including the electrode 9 containing copper of gold in its external surface as the main component and the solder 10 applied to the electrode 9, a camera 4 which picks up the images of the electrode 9 and solder 10 in an ultraviolet region with the light reflected on the object by receiving it, and a discriminating section 5 which discriminates the applied state of the solder 10 from the images picked up by means of the camera 4. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003332730(A) 申请公布日期 2003.11.21
申请号 JP20020139434 申请日期 2002.05.15
申请人 MURATA MFG CO LTD 发明人 KISHI KAZUHIRO
分类号 G01N21/956;H05K3/34;(IPC1-7):H05K3/34 主分类号 G01N21/956
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