| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for fabricating chip components for forming an insulative resin film with high accuracy except for an external electrode formation part on the surface of a chip main body. SOLUTION: The method comprises a step of preparing a chip main body; a step of forming an underlying electrode layer on an outer surface of the chip main body; a step of winding a resin wire on the outer surface of the chip main body not formed with the underlying electrode layer; a step of fusing the thread-like resin by a thermal treatment, smoothing a resinous surface and forming the resin film on the outer surface of the chip main body not formed with the underlying electrode layer; and a step of forming a plating electrode layer by electrolytic plating on the underlying electrode layer. COPYRIGHT: (C)2004,JPO
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