| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable wiring substrate housing IC chips, as well as its manufacturing method, that prevents defects in a fixing resin such as cracks, or improves the adhesiveness of the fixing resin. <P>SOLUTION: The wiring substrate 101 is provided with a core substrate (main substrate) 105, a housing part 141 comprised of through-holes passing through the substrate's principal surface 105a to the substrate's reverse surface 105b, IC chips IC2 housed in the housing part 141, and a fixing resin 147 that fixes the IC chips IC2 within the housing part 141. Further, it has a film 142 on the inner surface 141s of the housing part 141 created by use of a coupling agent, and the fixing resin 147 adheres to the housing part 141 via the film 142. <P>COPYRIGHT: (C)2004,JPO |
