| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that the cost reduction of the MMIC 203 mounting of an expensive multilayer ceramic substrate and the manufacturing a substrate of a large area are difficult, in a conventional microwave integrated circuit. <P>SOLUTION: In a multilayer substrate 101, Teflon (registered trade mark) is stuck on a first layer substrate 101a, and glass epoxy substrates are stuck on a second layer substrate 101b and a third layer substrate 101c. A first wiring layer 201a is made of a strip conductor, a second wiring layer 201b is made of a ground electrode 210 of a microstrip structure, and the layers 201a, 201b are used for transmitting a high frequency signal. A third wiring layer 201c and a fourth wiring layer 201d are used for an intermediate frequency, power supply and control. A viahole 211 is filled with a conductive material 209, thereby preventing a thermoplastic adhesive agent for mounting the MMIC 203 from flowing in the viahole. In the manufacturing method, a surface mounting device 103 is mounted by a reflow process, a deposit is removed, and a bare chip component 104 is face-up mounted on the ground electrode 210 by using the thermoplastic adhesive agent 208. <P>COPYRIGHT: (C)2004,JPO |
