| 摘要 |
<P>PROBLEM TO BE SOLVED: To dispose a support region supported by a conveying tray so as to cope with the increase in request of the number of bump electrodes in a semiconductor device, having a plurality of bump electrodes formed on one surface. <P>SOLUTION: The support regions 8, supported by the conveying tray, are sprinkled on the surface 20a of the semiconductor device 20. More particularly, the regions 8 are provided at the four corners of the surface 20a of the device 20. Thus, as compared with the case where the regions 8 are provided on the entire area of the outer periphery of the surface of the device 20 as in prior art, the area of the regions 8 can be reduced. As a result, since the area which can form the bump electrodes 6a is increased, increase in the request for the number of the bump electrodes 6a dealt with. <P>COPYRIGHT: (C)2004,JPO |
