| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which can eliminate such problems as a reduction in workability, an increase in cost, or the like, caused by two-step resin sealing including underfill sealing and overcoat sealing. <P>SOLUTION: The resin sealing seals a surface of a semiconductor chip and a space between the semiconductor chip and an interposer using a single liquid resin as a sealing resin. First, the resin is coated collectively at a time under the atmospheric pressure by a printing method, a potting method, or the like. Then, voids entrained during the coating process and voids confined in the space between the semiconductor chip and the interposer are removed under a negative pressure. Thereafter, the resin is hardened at a high temperature. <P>COPYRIGHT: (C)2004,JPO |
