METAL CORE SUBSTRATE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a metal core substrate and its manufacturing method which improve electrical characteristic and allow a high density wiring. SOLUTION: A first wiring pattern 45 is electrically connected to a second wiring pattern 46 by a conductor layer formed inside through holes. A first metal plate 11 is connected to the first wiring pattern 45 by a via formed through a first insulating layer 20, and to the second wiring pattern 46 by the via formed in a via-hole 28. A second metal plate 12 is connected to the second wiring pattern 46 by the via formed through a second insulating layer 21, and to the first wiring pattern 45 by the via formed in the via-hole. COPYRIGHT: (C)2004,JPO