| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve a durability and also a surface property at a high level. <P>SOLUTION: In this IC card, parts having an IC module 5 formed of an IC chip 5a, a reinforcement structure 5b adjacent to the IC chip 5a, and an antenna 5c are installed through adhesive agents 3 and 4 at specified positions between two opposed support bodies 1 and 2. When a drop height for dropping a steel ball therefrom against the IC card is h0 and a rebound height is h, the coefficient of rebound (h/h0) is 0.52 to 0.70. <P>COPYRIGHT: (C)2004,JPO</p> |
