METHOD OF FORMING MULTILAYERED CIRCUIT STRUCTURE AND SUBSTRATE HAVING MULTILAYERED CIRCUIT STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a method of forming multilayered circuit structure by which the adhesive property of a conductor circuit layer can be improved while the surface of an electrical insulating layer is kept in a flat state, and to provide a substrate having a multilayered circuit structure. SOLUTION: After a film of a curable composition composed of an insulating polymer and a curing agent is formed as the outermost layer of an internal substrate, the electrical insulating layer is formed on the surface of the film of the curable composition by bringing a compound having coordination geometry to a metal into contact with the surface of the insulating layer and curing the film of the curable composition. Then the surface of the formed electrical insulating layer is treated to have a hydrophilic property and a metallic thin film layer is formed on the surface of the insulating layer by using an ethylenediaminetetraacetic acid-copper complex. After the metallic thin film layer is formed, the conductor circuit layer containing the thin film layer is formed. COPYRIGHT: (C)2004,JPO