| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emission unit which sufficiently withstands the heat when lead terminals are soldered by increasing the heat resistance of a resin substrate constituting the light emission unit. SOLUTION: The light emission unit substrate 21 is molded by inserting a lead frame 22 into substrate resin and provided with an opening window 21a for mounting light emitting elements 23 (23a, 23b, 23c). As the material of the light emission unit substrate 12, resin with a high fusion pint, e.g. polyphtalamide resin, polyphenylene sulfide resin, or a liquid crystal polymer is used. The lead frame 22, on the other hand, consists of parts (lead terminal parts) 22 which are exposed to electrify the light emitting elements 23 from outside, a part (light emitting element mounted and connected part) 22b which is exposed in the opening window 21a to mount the light emitting elements 23, and a part (inner lead part) 22c which is hidden in the substrate resin, the lead terminal parts 22a being soldered to an unillustrated opposite circuit by using lead-free solder. COPYRIGHT: (C)2004,JPO
|
