SOCKET FOR ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR, AND MOUNTING STRUCTURE USING SOCKET FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a socket for an electronic component allowing a satisfactory mounting of a semiconductor element or device on a mounting substrate, and capable of being manufactured at low cost and mass-manufactured easily. SOLUTION: The socket 80 is provided between an electronic component such as a semiconductor element 90 and the mounting substrate 100, for detachably mounting the electronic component and establishing electrical connection between the electronic component and the substrate. A socket body 38b is formed of an electrically insulating material into a shape of a plate with a plurality of piercing holes. A metal terminal part 30a is supported at the periphery of each piercing hole of the socket body 38b, and a contact terminal 40 having a bent shape is provided on one of the surfaces of the metal terminal part 30a. COPYRIGHT: (C)2004,JPO