| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer flex-rigid wiring board with an excellent productivity such as shortened manufacturing processes, improved drilling workability, etc., and its manufacturing method. SOLUTION: In a multilayer flex-rigid wiring board in which an inner-layer flexible circuit board and an outer-layer rigid circuit board are bonded by an interlayer adhesive, the interlayer adhesive is an epoxy resin composition containing (A) an epoxy resin, (B) 4,4-diaminodiphenylsulfone as a hardening agent and (C) boron trifluoride complex compound as a curing accelerator as essential components. COPYRIGHT: (C)2004,JPO |
