| 摘要 |
PROBLEM TO BE SOLVED: To obtain a reflow apparatus that can surely solder each component by uniformly heating the component and a bonding material by performing direct heating with radiant energy jointly with heat-transfer heating even when the heat capacities and/or heat conduction of components having various sizes largely different from each other. SOLUTION: The reflow apparatus 10A in one embodiment of this invention is constituted to heat a substrate P to be treated held horizontally in a heating furnace section 15 by thermal transfer with hot air Fa produced in parallel with the substrate P by means of an air blowing section 12, a gas heating section 13, and a gas rectifying section 14, with the radiant energy from a plurality of small-sized far infrared radiation heaters 151a vertically movably supported by a vertically driving device 20 above the heating furnace section 15 and arranged in a zigzag state, and, if necessary, with the radiant energy from lower small-sized far infrared radiation heaters 152a arranged in a zigzag state below the substrate P. In addition, the apparatus 10A is constituted to uniformly heat and control all components provided on a substrate by interposing a heat shielding member 40 between the upper far infrared heaters 151a and substrate P to cover components which have relatively small heat capacities and/or are high in heat conduction. COPYRIGHT: (C)2004,JPO |
