发明名称 CIRCUIT CONNECTION MATERIAL AND METHOD OF MANUFACTURING CIRCUIT CONNECTION BODY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a circuit connection material which can prevent electrolytic corrosion due to the extended portion of a circuit connection body and will not generates failures in conductivity due to such galvanic corrosion, and to provide a method of manufacturing the circuit connection body using the same material. SOLUTION: There is provided a circuit connection material, which is a bonding agent including thermosetting resin for electrically connecting electrodes of substrates including circuit electrodes provided interposed by pressurization or heating process, by providing the bonding agent for circuit connection in between the substrates including circuit electrodes provided facingly. At the extending portion, the bonding agent is extended to the other circuit electrode from at least one circuit electrode, and the amount of chloride ions (Cl<SP>-</SP>) of the bonding agent of the protruded portion is 40 ppm or less. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003332385(A) 申请公布日期 2003.11.21
申请号 JP20020141609 申请日期 2002.05.16
申请人 HITACHI CHEM CO LTD 发明人 SATO KAZUYA;YUSA MASAMI
分类号 C09J7/00;C09J5/06;C09J9/02;C09J201/00;H01B1/00;H01B1/22;H01L21/60;(IPC1-7):H01L21/60 主分类号 C09J7/00
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