| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an interface circuit and a method for obtaining the same, in which an interface is determined by option information in the case where identical two chips for a semiconductor memory device are connected so as to face with each other for packaging as a flip chip. <P>SOLUTION: The flip chip interface circuit for a semiconductor memory device, in which the identical first and second semiconductor chips are assembled for packaging as a flip chip, comprises, a chip selection circuit for outputting first and second input pad selection signals and chip selection signals in accordance with the signals inputted from first and second address pads and first and second bonding option pads, which are, respectively, formed in the identical two chips, and a control circuit for data input/output control of the first and second semiconductor chips by outputting signals for selecting the first and second semiconductor chips upon receipt of the input pad selection signals and the chip selection signals, which have been outputted from the chip selection circuit. <P>COPYRIGHT: (C)2004,JPO</p> |
