| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a thick film circuit board, which is capable of forming a thick film copper conductor that is improved in conductor characteristics without deteriorating the resistance reliability of a ruthenium resistor. SOLUTION: The ruthenium resistor 2 is formed on an insulating board 1 in an atmospheric environment. After the ruthenium resistor 2 is formed on the insulating board 1, the thick film copper conductor 7 is formed on the ruthenium resistor 2 by baking carried out at low temperatures of 500 to 700°C so as to be electrically connected to the ruthenium resistor 2. By this setup, the thick film circuit board which is equipped with the thick film copper conductor 7 capable of coping with an increase in wiring density and a size reduction in a circuit, dealing with high frequencies, and carrying a large current, can be formed. COPYRIGHT: (C)2004,JPO
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