| 摘要 |
PROBLEM TO BE SOLVED: To obtain a test equipment for testing the characteristics of each chip by touching probes to the opposite sides of a semiconductor wafer in which the probe can be touched to various semiconductor wafer with an appropriate pressing force. SOLUTION: In the arrangement for touching the probes 26 and 27, respectively, to the opposite sides of the semiconductor wafer, variable amount of each probe 26, 27 is made variable on each side depending on the control amount of a control means. COPYRIGHT: (C)2004,JPO
|
