| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for securing flexural strength of an IC (chip) and for preventing a surface of a wafer from being oxidized (burnt) by mechanical grinding. SOLUTION: In the method of manufacturing the semiconductor device, a material with a fine grain size (#4,000) of abrasive particle constituting a grindstone having a short blade width (segment width) (2 mm) is used in a biaxial process for grinding the semiconductor wafer. COPYRIGHT: (C)2004,JPO
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