| 摘要 |
PURPOSE: A pad conditioner malfunction detecting apparatus of semiconductor polishing equipment is provided to be capable of preventing the generation of wafer polishing failure by detecting the state of a pad conditioner loaded at a cleaning cup using a weight sensing sensor. CONSTITUTION: A pad conditioner malfunction detecting apparatus of semiconductor polishing equipment is provided with a polishing head(10) for adsorbing a wafer, a polishing pad(16) installed at the lower portion of the polishing head for polishing the wafer, a platen(20) for fixing the polishing pad, a pad conditioner(14) spaced apart from the polishing head, and a cleaning cup(18) for cleaning the pad conditioner. The pad conditioner malfunction detecting apparatus further includes an HCLU for loading each wafer to the polishing head and a weight sensing sensor(24) installed at the inner portion of the cleaning cup for detecting the state of the pad conditioner loaded at the cleaning cup.
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