发明名称 |
JIG APPARATUS FOR FIXING WAFER |
摘要 |
PURPOSE: A jig apparatus for fixing a wafer is provided to be capable of preventing a needle polish wafer from being broken in a cleaning process. CONSTITUTION: A jig apparatus comprises a case(120), a wafer table(140), a cleaner storage tank(180), a cleaner inlet hole(124), and a guide(160). The case(120) is provided with a slope plane(127). The wafer table(140) is mounted on the slope plane(127) of the case and further includes a wafer insertion groove(142). The cleaner storage tank(180) is located in the case. The guide(160) is located at the lower portion of the slope plane(127).
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申请公布号 |
KR20030089022(A) |
申请公布日期 |
2003.11.21 |
申请号 |
KR20020026909 |
申请日期 |
2002.05.15 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
AHN, GAP RYEOL;HWANG, IN SEOK;JANG, IN HUN;LEE, HO YEOL;NAM, DO HYEON |
分类号 |
H01L21/02;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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