发明名称 JIG APPARATUS FOR FIXING WAFER
摘要 PURPOSE: A jig apparatus for fixing a wafer is provided to be capable of preventing a needle polish wafer from being broken in a cleaning process. CONSTITUTION: A jig apparatus comprises a case(120), a wafer table(140), a cleaner storage tank(180), a cleaner inlet hole(124), and a guide(160). The case(120) is provided with a slope plane(127). The wafer table(140) is mounted on the slope plane(127) of the case and further includes a wafer insertion groove(142). The cleaner storage tank(180) is located in the case. The guide(160) is located at the lower portion of the slope plane(127).
申请公布号 KR20030089022(A) 申请公布日期 2003.11.21
申请号 KR20020026909 申请日期 2002.05.15
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AHN, GAP RYEOL;HWANG, IN SEOK;JANG, IN HUN;LEE, HO YEOL;NAM, DO HYEON
分类号 H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/02
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