发明名称 POLYPROPYLENE RESIN COMPOSITION
摘要 <p>The invention relates to a polypropylene resin composition which comprises (A) a polypropylene component and (B) a copolymer elastomer component and has an MFR of 0.1 to 15.0g/10min and a propylene unit content of the component (B) of 50 to 85 % and the xylene solubles Xs of which satisfy the following requirements (I) to (V), and the composition can give moldings which are excellent in the balance between impact resistance and rigidity at low temperature and transparency as well as films excellent in heat-sealing strength: (I) the fraction of propylene (Fp) is 50 to 80 %, (II) the limiting viscosity [η]Xs of the xylene solubles Xs is 1.4 to 5 dL/g, (III) the ratio of [η]Xs/[η]Xi (limiting viscosity of xylene insolubles Xi) is 0.7 to 1.5, (IV) the propylene content (Pp) of high-propylene-content component is 60 to 95 % and the propylene content (P’p) of low-propylene -content component is 20 to 60 %, and (V) Pp, P’p, Pf1 (the proportion of Fp which the high-propylene-content component accounts for), and (1-Pf1) (the proportion of Fp which the low-propylene-content component accounts for) satisfy a specific relationship.</p>
申请公布号 WO2003095551(P1) 申请公布日期 2003.11.20
申请号 JP2003005836 申请日期 2003.05.09
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