NON-THERMIONIC SPUTTER MATERIAL TRANSPORT DEVICE, METHODS OF USE, AND MATERIALS PRODUCED THEREBY

摘要

A sputter transport device (100) comprises a sealed chamber (102), a negatively-biased target cathode holder (106) disposed in the chamber, and a substrate holder (130) disposed in the chamber (102) and spaced at a distance from the target cathode (104). A negatively-biased, non-thermionic electron/plasma injector assembly (150) is disposed between the target cathode (104) and the substrate holder (130). The injector assembly (150) fluidly communicates with a gas source and includes a plurality of hollow cathodes. Each hollow cathode includes an orifice communicating with the chamber. The device can be used to produce thin-films and ultra-thick materials in polycrystalline, single-crystal and epitaxial forms, and thus to produce articles and devices that are useful as metallic or insulating coatings, and as bulk semiconductor and opto-electronic materials.