Solid-state imaging device and manufacturing method for solid-state imaging device

摘要

A solid-state imaging device, comprises: a semi-conductor substrate demarcating a two-dimensional surface; a multiplicity of photoelectric conversion units formed being arranged in a plurality of rows and columns on the semiconductor substrate; a planarizing insulating film formed above the semiconductor substrate; and a plurality of gap-less microlenses having spectral characters, each gap-less microlens being formed above each of the photoelectric conversion units with the planarizing insulating film placed in-between.