发明名称 |
Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto |
摘要 |
A laminate having improved resistance to separation failure when incorporated into a flexible circuit structure. The laminate comprising a highly bondable polyimide and is preferably formed from a polyamic acid comprising a tetracarboxylic acid component, a diamine component, and 0.1 to 5.0 mole % of a dicarboxylic acid component, with respect to the tetracarboxylic acid component, and wherein the adhesive strength of the laminate is greater than 10 N/cm, and more preferably greater than 19 N/cm.
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申请公布号 |
US2003215654(A1) |
申请公布日期 |
2003.11.20 |
申请号 |
US20020150233 |
申请日期 |
2002.05.17 |
申请人 |
MORIYAMA HIDEKI;UHARA KENJI;DUNBAR MEREDITH L.;EDMAN JAMES R. |
发明人 |
MORIYAMA HIDEKI;UHARA KENJI;DUNBAR MEREDITH L.;EDMAN JAMES R. |
分类号 |
B32B15/088;B32B15/08;B32B27/34;C08G73/10;H05K1/03;(IPC1-7):B32B27/00 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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