| 摘要 |
The invention relates to a pick-and-place device, a pick-and-place system and a method for placing components on substrates, according to which feeders with a plurality of feeding modules (100) and a corresponding plurality of pick-up locations (150) are provided on opposite sides of the feeders with at least one placement zone (210-1, 210-2) each. Said placement zones are associated with pick-up heads (300-1, 300-2) by means of which the components to be positioned on substrates (200-1, 200-2) which are arranged in the placement zones (210-1 or 210-2) can be alternately and/or simultaneously picked up at the pick-up locations of the feeders. The pick-and-place capacity per surface of the pick-and-place device, the pick-and-place system and the method for placing components on substrates according to the invention is substantially higher than that of conventional devices, systems and methods. |
