Ground discontinuity improvement in RF device matching

摘要

Device mounting cutouts in PCBs often alter desired characteristic trace impedances by disrupting the continuous low-impedance electrical connection between two or more ground planes that contribute to the control of the trace impedances. Maintaining control of the trace impedances is particularly important in PCBs containing RF devices. Plating one or more inner walls of an RF device mounting cutout with a conductive material in areas proximate to an RF trace enhances RF trace impedance control by establishing a low-impedance electrical connection between the ground planes at the cutout edges. In areas where RF traces contact the conductive plating, notches physically isolating the RF traces from the conductive plating also provide electrical isolation.