发明名称 |
Semiconductor package and method of preparing same |
摘要 |
A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 mum/m° C. between -40 and 150° C. and a modulus of from 1 to 300 MPa at 25° C., and the silicone member is prepared by the method of the invention. |
申请公布号 |
US2003214051(A1) |
申请公布日期 |
2003.11.20 |
申请号 |
US20020068755 |
申请日期 |
2002.05.16 |
申请人 |
DENT STANTON JAMES;LARSON LYNDON JAMES;NELSON ROBERT THOMAS;RASH DEBRA CHARILLA |
发明人 |
DENT STANTON JAMES;LARSON LYNDON JAMES;NELSON ROBERT THOMAS;RASH DEBRA CHARILLA |
分类号 |
C08L83/05;C08L83/07;H01L21/60;H01L21/768;H01L23/29;H01L23/31;H01L23/485;H01L23/532;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
C08L83/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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