| 摘要 |
The present invention discloses a heat dissipating flip-chip Ball Grid Array (BGA) (10). In one embodiment, the flip-chip BGA comprises a substrate (12), a die (14), a first set of solder balls (16) adapted to couple the die with the substrate, a thermal compound (20) adapted to couple to a backside of the die, a second set of solder balls (28) adapted to couple with the substrate, and a printed circuit board (22) comprising a heat dissipating metal (24), wherein the heat dissipating metal is adapted to couple with the thermal compound, and wherein the second set of solder balls is adapted to couple with the printed circuit board.
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