| 摘要 |
An integrated circuit burn-in test system includes an integrated circuit and a tester. The integrated circuit includes operating circuitry, a heater for heating the operating circuitry, and burn-in test circuitry for testing the operating circuitry while being heated. A package surrounds the operating circuitry, the heater and the burn-in test circuitry. The burn-in test circuitry causes the operating circuitry to operate and generate data related thereto. The tester receives data from the burn-in test circuitry. The heater may be configured within the package to heat at least one predetermined portion of the operating circuitry.
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