发明名称 |
MULTISTEP RELEASE METHOD FOR ELECTROCHEMICALLY FABRICATED STRUCTURES |
摘要 |
Multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching Operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching Operations may be separated by cleaning Operations, or barrier material removal Operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched. |
申请公布号 |
WO03095709(A2) |
申请公布日期 |
2003.11.20 |
申请号 |
WO2003US14663 |
申请日期 |
2003.05.07 |
申请人 |
MEMGEN CORPORATION |
发明人 |
COHEN, ADAM, L.;LOCKARD, MICHAEL, S.;MCPHERSON, DALE, S. |
分类号 |
B81B3/00;G01P15/08;G01P15/125;H01P1/202;H01P3/06;H01P5/18;H01P11/00;H05K3/46 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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