发明名称 |
Multi-feature-size electronic structures |
摘要 |
Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.
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申请公布号 |
US2003214792(A1) |
申请公布日期 |
2003.11.20 |
申请号 |
US20030464031 |
申请日期 |
2003.06.17 |
申请人 |
CREDELLE THOMAS LLOYD;GENGEL GLENN;STEWART ROGER GREEN;JOSEPH WILLIAM HILL |
发明人 |
CREDELLE THOMAS LLOYD;GENGEL GLENN;STEWART ROGER GREEN;JOSEPH WILLIAM HILL |
分类号 |
G06K19/07;G06K19/077;H01L29/06;H05K1/11;H05K1/14;H05K1/18;H05K3/22;H05K3/32;H05K7/02;(IPC1-7):H05K7/02;H05K7/06;H05K7/08;H05K7/10 |
主分类号 |
G06K19/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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