High speed wafer sort and final test

摘要

A semiconductor device which receives and transmits data at high speed is tested at operational speed at wafer sort. A probe card includes a high-speed interconnect that couples probe output bonding pads to probe input bonding pads. The high-speed interconnect connects a respective output of a transmitter in the die to a respective input of a receiver in the die while the probe card is connected to the die. A built in self test circuit in the die generates test patterns and compares them for accuracy. The test patterns are routed on the high-speed interconnect from the output of the transmitter to the input of the receiver allowing the data path through the receiver and transmitter in the die to be tested at operational speed before the die is assembled into a package.